2 Layer Ceramic Printed Circuit Board , AL2O3 Ceramic Material , 1.2MM Thickness
PCB Specifications:
Layer Count: 2 Layer Ceramic PCB
Board Thickness: 1.2MM
Material: AL2O3, Ceramic
Copper Thickness: 1/1OZ
Capabilities:
| Item | Capability |
| Layer Count | 1-24 Layers |
| Board Thickness | 0.1mm-6.0mm |
| Finished Board Max Size | 700mm* 800mm |
| Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
| Warp | <0.7% |
| Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc |
| Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
| Drill Hole Diameter | 0.1mm-6.5mm |
| Out Layer Copper Thickness | 1/20Z-8OZ ; |
| Inner Layer Copper Thickness | 1/3OZ-6OZ |
| Aspect Ratio | 10:1 |
| PTH Hole Tolerance | +/-3mil |
| NPTH Hole Tolerance | +/-1mil |
| Copper Thickness Of PTH Wall | >10mil(25um) |
| Line Width And Space | 2/2mil |
| Min Solder Mask Bridge | 2.5mil |
| Solder Mask Alignment Tolerance | +/-2mil |
| Dimension Tolerance | +/-4mil |
| Max Gold Thickness | 200u'(0.2mil) |
| Thermal Shock | 288C, 10s, 3 Times |
| Impedance Contro | +/-10% |
| LTest Capability | PAD Size Min 0.1mm |
| Min BGA | 7mil |
| Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Question: What is PCB Etch Factor?
Answer: PCB Etch Factor or etch compensation is an etching process modification used by the PCB manufacturers to decide the extent and accuracy of etching. It helps the designers and manufacturers decide the minimum etching allowance on the track width. During etching, unwanted copper is removed gradually from the PCB surface to realize the desired conductive track. For instance, if a PCB design requires a track width of 0.25 mm, then the manufacturer has to initiate etching if the track width is more than 0.25 mm. The amount by which the track width is increased is called etch factor. It is proportional to the copper weight required to be removed. More copper to be removed indicates a higher value of the etch factor.
No etching process gives perfect straight cuts, they always create undercut, an etching defect, which can be seen in the figure below.
In mathematical terms, an etch factor is the ratio of track width to the amount of undercut. The PCB CAD designer has to provide enough spacing in the design so that a manufacturer is able to utilize that space to start etching with a little wider track. The minimum spacing in the design must meet the manufacturer’s decided minimum space.
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2 Layer 1.2MM AL2O3 Ceramic Printed Circuit Board Images
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